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Dr. Ronggui Yang is currently a Professor of Energy and Power Engineering at Huazhong University of Science and Technology in China. He was a Full Professor of Mechanical Engineering at the University of Colorado Boulder (2006-2019). Dr. Yang received his PhD degree focusing on Nanoscale Heat Transfer with Professor Gang Chen in Mechanical Engineering and Professor Mildred Dresselhaus from MIT in February 2006. Since January 2006, he started his faculty career as an Assistant Professor at CU-Boulder and has been promoted to Associate Professor (two-years ahead of normal tenure clock) in summer 2011 and to Full Professor in summer 2016. Prior to MIT, he had a Master’s degree in MEMS from UCLA in 2001, a Master’s degree in Engineering Thermophysics from Tsinghua University in Beijing in 1999, and a Bachelor’s degree in Thermal Engineering from Xi’an Jiaotong University in 1996. His research interests are on the fundamentals of transport phenomena (thermal conduction, thermal radiation, thermoelectrics, liquid-vapor phase-change heat transfer) and the applications of micro/nanotechnologies for thermal, energy, and information systems. His notable contributions include developing multiscale simulation framework for thermal and thermoelectric transport in nanostructured materials, developing hybrid micro/nano-structured surfaces for phase-change heat transfer enhancement, the first experimental demonstration of quasi-ballistic phonon transport using ultrafast pump-and-probe method with soft X-ray, and most recently the development and applications of low-cost radiative cooling materials. Dr. Ronggui Yang has published >240 journal papers, delivered ~200 invited seminars and is associated with >150 invited and contributed conference talks and posters that garnered numerous best paper/presentation/poster awards. His journal papers are highly cited (listed as a Clarivate Highly Cited Researcher by Clarivate from 2021 to 2023), with an H-index of 74, a total citation > 24500 times as of December 31, 2023 (an H-Index of 86, a total citation > 32,300 times and an annual citation ~ 5000 times in 2022, per Google Scholar).  His innovative research has won him numerous awards including: In August 2023, on the list of effective can-didates for additional election of academicians of the CAS Member (recommended by the Chinese Association for Science and Technology), the 2020 Nukiyama Memorial Award in Thermal Science and Engineering (one selected worldwide every two years, ~50 years old), the 2017 Top 10 Physics Breakthrough by PhysicsWorld, the 2014 ITS Young Investigator in Thermoelectrics from International Thermoelectric Society (ITS, one selected annually), the 2010 ASME Bergles-Rohsenow Young Investigator Award in Heat Transfer (one selected annually), an NSF CAREER Award in 2009, the MIT Technology Review’s TR35 Award and the DARPA Young Faculty Award in 2008, the 2005 Goldsmid Award for Research Excellence in Thermoelectrics by a Graduate Student from ITS (one selected annually), and a NASA Tech Brief Award for a Technical Innovation in 2004. He was an invited participant for the 15th U.S. Frontiers of Engineering Symposium by National Academy of Engineering (2009), an invited participant for Arab-American Frontiers in Science, Engineering, and Medicine by US National Academies of Science and Engineering (NAS & NAE) in 2016, and an invited participant for the Chinese-American Frontiers in Engineering by the US NAE & Chinese Academy of Engineering in 2017. He has also won the Provost’s Achievement Award (2012), the Dean’s Performance Award (2010), the Woodward Outstanding Faculty of Mechanical Engineering (2011) and the Outstanding Research Award in Mechanical Engineering (2008, 2013, & 2017) from the University of Colorado Boulder. He was endowed with the S.P. Chip and Lori Johnson Faculty Fellow for 2013-2017 and the Sanders Faculty Fellow for 2008-2012. Dr. Yang is also well recognized for his professional services. Dr. Yang is currently the Past Chair (2017-2019), Chair (2015-2017) and Founding Vice-Chair (2012-2015) of the K-9 Technical Committee on Nanoscale Thermal Transport of ASME Heat Transfer Division. In 2015, Dr. Yang is elected a Fellow of ASME. He was also an Associate Editor for ASME Journal of Heat Transfer, a Guest Editor for ASME Journal of Electronic Packaging, and Associate Editor for Heat Transfer Research published by Begell House Inc.

   Email：ronggui@hust.edu.cn
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